Laysen Chip Testing has terminated its planned acquisition of Guoxin Micro (Chongqing) Technology , ending a process that began in December 2024. The decision followed extensive due diligence covering legal, financial, operational, and technical aspects – leading both parties to conclude that current conditions were not ripe for the deal.

The termination agreement was signed on September 4, making the original letter of intent void except for confidentiality clauses. No party is in breach or liable for damages.

Guoxin Micro, based in Chongqing Hi‑tech Zone, is a third‑party IC test service provider covering wafer, finished‑product, and module testing. Laysen, listed on the STAR Market since November 2020, offers 8‑inch and 12‑inch wafer testing, finished‑chip testing, and supports advanced nodes down to 3nm across communications, computing, consumer, automotive, and industrial segments.

ICgoodFind Takeaway:
M&A in semiconductor testing is getting tougher. Laysen's decision to walk away reflects a more cautious investment climate – and the competitive landscape in third‑party testing remains fluid.